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Notes on Using Narrow-pitch Connectors (Common)
Regarding soldering
1. Re?ow soldering
1) Measure the recommended pro?le
temperature for re?ow soldering by
placing a sensor on the PC board near
Soldering conditions
Please use the re?ow temperature pro?le
conditions recommended below for
re?ow soldering. Please contact us
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
before using a temperature pro?le other
than that described below (e.g. lead-free
solder).
? Narrow-pitch connectors
Product name
SMD type connectors
Soldering iron temperature
300 ° C within 5 sec.
350 ° C within 3 sec.
with it.)
2) As for cream solder printing, screen
printing is recommended.
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
2) Do not allow ?ux to spread onto the
connector leads or PC board. This may
lead to ?ux rising up to the connector
200 ° C
3) To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
Temperature
Peak temperature 260 ° C
230 ° C
180 ° C
Peak temperature
220 ° C
Preheating
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
diagrams in the recommended patterns
for PC boards and metal masks. Make
150 ° C
60 to 120 sec.
25 sec.
70 sec.
connector terminal are heated, apply the
solder wire so it melts at the end of the
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
? Narrow-pitch connector (P8)
Time
connector terminals.
Apply the solder
otherwise, interference by the solder will
cause an imperfect contact.
Terminal
Paste
solder
Temperature
245 ° C max.
155 to 165 ° C
Peak temperature
200 ° C
Preheating
60 to 120 sec.
Within 30 sec.
Terminal
wire here
Small angle as
possible up to
45 degrees
PC board
foot pattern
4) Consult us when using a screen-
printing thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly ?xed to the PC board. (Double
re?ow soldering on the same side is
possible.)
6) N 2 re?ow, conducting re?ow soldering
in a nitrogen atmosphere, increases the
solder ?ow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature pro?le are
appropriate.
Time
For products other than the ones above,
please refer to the latest product
speci?cations.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature pro?les given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed re?ow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screen-
printing thickness other than that
recommended.
10) Some solder and ?ux types may
cause serious solder creeping. Solder
and ?ux characteristics should be taken
into consideration when setting the re?ow
soldering conditions.
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a ?at tip. To prevent
?ux from climbing up to the contact
surfaces, do not add more ?ux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
ACCTB48E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
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